Photosensitive - Solvent Developable

Fujifilm’s solvent developable polyimides are a family of photo-imageable polyimide precursors, covering both high and low cure temperatures for edistribution layer (RDL) and buffer coat applications.

  • Negative acting, solvent developable polyimides
  • Photo-imageable using g-line and/or i-line exposure tools
  • Low or high temperature cure options
  • Fast photospeed for high throughput
  • Excellent mechanical properties for high reliability
  • NMP free offerings for both high and low temperature cure

See Product Overview and Datasheets for more details

  • LTC 9300 Series: Low temperature cure polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. LTC 9300 series polyimides are ideally suited for redistribution layer applications for advanced packaging.
  • Durimide® 8300 Series: High temperature cure polyimides are photo-imageable polyimide precursors which are sensitive both in g- and i-line. They can therefore be imaged on all exposure tools. Durimide® 8300 series polyimides are ideally suited for buffer coat application in high reliability packages.

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