TSV CMP Slurries

FUJIFILM Planar Solutions TSV CMP slurries are designed for the high removal rate processes needed to support Through-Silicon Via (TSV) technologies.

Market-leading products are available to meet the performance requirements for a broad range of process and technology requirements.

FUJIFILM Planar Solutions TSV copper slurries feature:

  • Ultra high removal rates to maximize throughput of copper CMP process for emerging TSV technologies
  • Attractive cost of ownership due to concentrated formulations
  • Ease of use – Special cleaning chemistries or process conditions are not required

Available TSV CMP Slurries:

  • CSL9215C
    • Ultra high copper removal rate TSV slurry for superior throughput
    • Copper removal rates tune-able at the customer site
    • Extremely high selectivity to barrier films
    • Concentrated formulation for low cost of ownership
  • CSL9214C
    • High removal rate copper TSV slurry formulated for emerging die stacking technologies
    • Tunable topographical performance
    • Copper removal rates tune-able at the customer site
    • Extremely high selectivity to barrier films
    • Concentrated formulation for low cost of ownership

Contact Us for more information and a complete product overview

FUJIFILM Planar Solutions TSV slurries are designed for both conventional and emerging die stacking technologies

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