Emerging Metal Slurries

FUJIFILM Electronic Materials Cobalt CMP slurries are designed to polish cobalt and barrier metals and planarize all films in the circuits during advanced Cobalt interconnect polish

Market-leading products are available to meet a broad range of process and technology requirements.

FUJIFILM Electronic Materials cobalt CMP slurries feature:

  • Outstanding corrosion protection for sensitive cobalt features
  • Compatibility with a wide range of integration schemes including varies dielectrics, etch hard masks, and ARC layers
  • Tunable selectivity to meet customized film stacking and final finishing targets
  • Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use

Available Cobalt CMP Slurries:

  • MSL5100C
    • Step 1 Cobalt slurry platform for removal of damascene Co metal features
    • Highly concentrated for low cost of ownership
    • Proprietary corrosion inhibitor system provides excellent corrosion protection of Cobalt metal
    • Good planarization efficiency
    • Tunable selectivity to Ti and TiN
  • MSL5200C
    • Step 2 Cobalt slurry platform for final polish of damascene Co metal and dielectric features
    • Concentrated formulation for attractive cost of ownership
    • Tunable Co removal rate, independent of other films
    • Excellent surface finish with excellent Cobalt metal protection

Contact Us for more information and a complete product overview

FUJIFILM Electronic Materials Cobalt CMP slurries are designed to polish Cobalt and barrier metals. Slurries are developed to planarize Cobalt interconnect films