Copper CMP Slurries

FUJIFILM Electronic Materials copper CMP slurries are designed to remove the copper overfill to expose underlying damascene interconnects.

Market-leading products are available to meet the performance requirements for a broad range of process and technology requirements.

FUJIFILM Electronic Materials copper CMP slurries feature:

  • High removal rates, high planarization efficiency, low topography, low defectivity, and excellent over polish margins
  • Tunable formulations – with independent component knobs for customer’s specific performance targets
  • High selectivity to common barrier films resulting in easy end-point detection and good Cu residual clearing without compromising topography
  • Strong Prestonian behavior in Cu polishing for easy process development and control
  • Low cost of ownership due to highly concentrated formulations
  • Ease of use – Special cleaning chemistries or process conditions are not required

Available Copper CMP Slurries:

  • CSL9044C
    • Developed for a wide variety of devices including leading edge circuits
    • Well proven and established product in Cu applications
    • Provides high removal rates to maximize process throughput
    • High selectivity to barrier films
    • Low defectivity
    • Excellent copper clearing capability
    • High planarization efficiency
    • Low dishing and erosion
    • Robust process can be developed for a great range of applications from mature technology nodes to the most advanced nodes including thick metal layers
  • CSL9400C
    • Developed for leading edge circuits
    • Higher removal rates to maximize process throughput and reduce Cu polish to 1 platen
    • Excellent selectivity to barrier films
    • Significantly low defectivity
    • Excellent copper clearing capability
    • Low but tunable dishing and erosion
    • Suitable for a range of technology nodes including logic, memory or thick metal polishing
  • CSL9500C
    • Developed for leading edge circuits including Ruthenium liner integrations
    • Provides high removal rates to maximize process throughput
    • Excellent selectivity to barrier films
    • Ultra low defectivity
    • Excellent copper clearing capability
    • Low but tunable dishing and erosion
    • Suitable for the most advanced integration applications
  • CSL9215C
    • Developed for very thick metal applications
    • Ultra removal rates to maximize process throughput for TSV Copper removal
    • Excellent selectivity to barrier films
    • Low defectivity
    • Excellent copper clearing capability
    • Topography following copper clear meets TSV requirements

Contact Us for more information

FUJIFILM Electronic Materials copper slurries are designed for first generation copper interconnects through the latest leading edge technologies