FUJIFILM Electronic Materials copper CMP slurries are designed to remove the copper overfill to expose underlying damascene interconnects.
Market-leading products are available to meet the performance requirements for a broad range of process and technology requirements.
FUJIFILM Electronic Materials copper CMP slurries feature:
Available Copper CMP Slurries:
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FUJIFILM Electronic Materials copper slurries are designed for first generation copper interconnects through the latest leading edge technologies