Copper CMP Slurries

FUJIFILM Electronic Materials copper CMP slurries are designed to remove the copper overfill to expose underlying damascene interconnects.

Market-leading products are available to meet the performance requirements for a broad range of process and technology requirements.

  • FUJIFILM Electronic Materials copper CMP slurries feature:
    • Advanced performance – High removal rates, low topography, low defectivity, and excellent over polish margins
    • Tunable formulations – Products can be quickly tuned to meet customer’s integration targets
    • Compatible with low-k and ultra low-k dielectric integration schemes
    • Low cost of ownership due to highly concentrated formulations
    • Ease of use – Special cleaning chemistries or process conditions are not required

Available Copper CMP Slurries:

  • CSL9100C
    • Compatible with emerging barrier films
    • Improved defectivity for leading edge technologies
    • Tunable topographical performance
    • Provides high removal rates to maximize process throughput
  • CSL9044C
    • Developed for leading edge circuits
    • Provides high removal rates to maximize process throughput
    • Extremely high selectivity to barrier films
    • Significantly low defectivity
    • Excellent copper clearing capability
    • Topography following copper clear is exceptionally low with minimal dishing and erosion
    • Depending on the topography requirements, this product may be applicable for technology nodes ranging from 130nm through 20nm
  • CSL9042C
    • Developed for 2nd and 3rd generation circuits
    • Provides high removal rates to maximize process throughput
    • Extremely high selectivity to barrier films
    • Significantly low defectivity
    • Excellent copper clearing capability
    • Improved topographical performance over CSL9041C
  • CSL9041C
    • Developed for 1st and 2nd generation copper interconnects
    • Provides very high removal rates to maximize process throughput
    • Extremely high selectivity to barrier films
    • Low defectivity
    • Excellent copper clearing capability
    • Topographical performance is appropriate for mature copper technology nodes

Contact Us for more information

FUJIFILM Electronic Materials copper slurries are designed for first generation copper interconnects through the latest leading edge technologies

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