Barrier CMP Slurries

FUJIFILM Planar Solutions barrier CMP slurries feature:

• Outstanding corrosion protection for sensitive copper features
• Compatibility with a wide range of integration schemes including low-K and ULK dielectrics, etch hard masks, and ARC layers
• Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use

Available Copper Barrier CMP Slurries:

• BSL8210C
  • Acidic barrier slurry designed for advanced integration schemes that utilize low-K/ULK dielectrics
  • High purity colloidal silica
  • Tunable Cu removal rate
  • Low/tune-able removal rates of ULK dielectric films
  • Excellent performance on hard CMP pads with very low defectivity
  • Concentrated formulation for attractive cost of ownership
• BSL8140C
  • Alkaline barrier slurry designed for advanced integration schemes that utilize low-K/ULK dielectrics and metal hard masks
  • High purity colloidal silica
  • Wide range of tune-ability for Copper and low-K/ULK removal rates
  • Ultra low defectivity
  • Excellent performance on soft pads
  • Concentrated formulation for low cost of ownership
• BSL8176C
  • A concentrated version of BSL8072
  • Extremely wide range of tune-ability of Copper and low-k/ULK removal rates
  • High purity colloidal silica
  • Ultra-low defectivity
  • Excellent performance on soft pads
  • Concentrated formulation for low cost of ownership
• BSL8072
  • Alkaline barrier slurry designed for a wide variety of integration schemes that utilize low-K dielectrics
  • High purity colloidal silica
  • Designed for 90nm and below technology nodes
  • Extremely wide range of tune-ability for Copper and low-K removal rates
  • Very low defectivity
  • Excellent performance on soft pads
• Cu18K and Cu20K
  • Concentrated versions of Cu10K for reduced cost of ownership
  • Improved defectivity over Cu10K
• Cu10K
  • Ready-to-use alkaline barrier slurry designed for 65nm and above technology nodes
  • High purity fumed silica
  • Excellent topography correction

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FUJIFILM Planar Solutions barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.

• Copper CMP Slurries
• Front End CMP Slurries
• TSV CMP Slurries
• Other CMP Slurries