Barrier CMP Slurries

FUJIFILM Electronic Materials barrier CMP slurries feature:

• Outstanding corrosion protection for sensitive copper features
• Compatibility with a wide range of integration schemes including low-K and ULK dielectrics, etch hard masks, and ARC layers
• Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use

Available Copper Barrier CMP Slurries:

• BSL8210C
  • Acidic barrier slurry designed for advanced integration schemes that utilize low-K/ULK dielectrics
  • High purity colloidal silica
  • Tunable Cu removal rate
  • Low/tune-able removal rates of ULK dielectric films
  • Excellent performance on hard CMP pads with very low defectivity
  • Concentrated formulation for attractive cost of ownership
• BSL8140C
  • Alkaline barrier slurry designed for advanced integration schemes that utilize low-K/ULK dielectrics and metal hard masks
  • High purity colloidal silica
  • Wide range of tune-ability for Copper and low-K/ULK removal rates
  • Ultra low defectivity
  • Excellent performance on soft pads
  • Concentrated formulation for low cost of ownership
• BSL8176C
  • A concentrated version of BSL8072
  • Extremely wide range of tune-ability of Copper and low-k/ULK removal rates
  • High purity colloidal silica
  • Ultra-low defectivity
  • Excellent performance on soft pads
  • Concentrated formulation for low cost of ownership
• BSL8072
  • Alkaline barrier slurry designed for a wide variety of integration schemes that utilize low-K dielectrics
  • High purity colloidal silica
  • Designed for 90nm and below technology nodes
  • Extremely wide range of tune-ability for Copper and low-K removal rates
  • Very low defectivity
  • Excellent performance on soft pads
• Cu18K and Cu20K
  • Concentrated versions of Cu10K for reduced cost of ownership
  • Improved defectivity over Cu10K
• Cu10K
  • Ready-to-use alkaline barrier slurry designed for 65nm and above technology nodes
  • High purity fumed silica
  • Excellent topography correction

Contact Us for more information

FUJIFILM Electronic Materials barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.

• Copper CMP Slurries
• Front End CMP Slurries
• TSV CMP Slurries
• Other CMP Slurries