FUJIFILM Planar Solutions barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.
Market-leading products are available to meet a broad range process and technology requirements.
FUJIFILM Planar Solutions barrier CMP slurries feature:
Available Copper Barrier CMP Slurries:
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FUJIFILM Planar Solutions barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.