Polyamide-Imide Polymers (PAI)

SR Series Polyamide-imides (PAI) are robust, chemical resistant, thermally stable polymers.

 

The polymers will typically withstand extended service temperatures >240°C. Coatings produced from SR Series polymers have been used in non-stick cookware, dry film lubrication, wire insulation, can coating, composites and aerospace applications. SR Series polymers comply with FDA 177.2450.

NMP - N-methyl pyrrolidone
NEP - N-ethyl pyrrolidone
Solvented Polyamide-Imide Systems
Product Description Solids (%) Viscosity @ 23°C Density @ 23°C Application  
         
Aerospace
Composites
Electronics
Metal Coatings
PTFE Binder
FDA 177-2450
SR3602-35H PAI in NMP 35-37 4000-5000 mPas 1.1    
SR3602-35W PAI in NMP 35-37 2750-3750 mPas 1.1    
SR3602-37W PAI in NMP 34-36 4000-6000 mPas 1.1    
SR3603-30 PAI in NMP/xylene 27-29 500-800 mPas 1.1
SR3604-35 PAI in NEP 35-37 2800-3600 mPas 1.1    
SR3604-35L PAI in NEP 34-37 1800-2400 mPas 1.1    
Water Dilutable Polyamide-Imide Systems
Product Description Solids (%) Viscosity @ 23°C Density @ 23°C Application  
         
Aerospace
Composites
Electronics
Metal Coatings
PTFE Binder
FDA 177-2450
SR3602-28 PAI diluted in NMP/H20 27-29 5000-7500 mPas 1.05
SR3604-28A PAI diluted in NEP/H20 27-29 4000-8000 mPas 1.05  
IsoCoat 401 PAI diluted in NMP/H20 28-30 6000-12000 mPas 1.05

Note

Specifications given as a guide. Full specifications available upon request.
Email orders and information requests to: paiorders@fujifilm.com