SILICON WAFER
PREPARE
PATTERN & ETCH
REMOVAL
CMP
DEPOSIT LAYER
MODIFY ELECTRICAL PROPERTIES
PROTECTIVE COATING & RDL
DICE
CHIP
PATTERN & ETCH
A wide range of advanced photoresist products and ancillaries, complimented with etchants.
CMP
Chemical Mechanical Planarization (CMP) is a critical process in the fabrication of microchips
DEPOSIT LAYER
Chemical Vapor Deposition (CVD) for dielectrics
PROTECTIVE COATING & RDL
Specialty stress relief coatings used as protective layer (buffer coat) and/or Re-Distribution Layer (RDL)