CMP

Chemical mechanical planarization (CMP) is a critical process in the fabrication of advanced semiconductor devices or “microchips” used in today’s electronics.

CMP slurries are employed to polish and planarize complex layers of integrated circuits to customer specific requirements. FUJIFILM Planar Solutions offers variety of CMP slurries to support a broad range of technology nodes and process integration requirements, allowing our customers to achieve excellent product yields and reliability at a compelling cost of ownership.