Barrier CMP Slurries

FUJIFILM Planar Solutions barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.

Market-leading products are available to meet a broad range process and technology requirements.

FUJIFILM Planar Solutions barrier CMP slurries feature:

  • Outstanding corrosion protection for sensitive copper features
  • Compatibility with a wide range of integration schemes including low-K and ULK dielectrics, etch hard masks, and ARC layers
  • Attractive cost of ownership – Concentrated formulations available to provide lower cost at point-of-use

Available Copper Barrier CMP Slurries:

  • BSL8210C
    • Acidic barrier slurry designed for advanced integration schemes that utilize low-K/ULK dielectrics
    • High purity colloidal silica
    • Tunable Cu removal rate
    • Low/tune-able removal rates of ULK dielectric films
    • Excellent performance on hard CMP pads with very low defectivity
    • Concentrated formulation for attractive cost of ownership
  • BSL8140C
    • Alkaline barrier slurry designed for advanced integration schemes that utilize low-K/ULK dielectrics and metal hard masks
    • High purity colloidal silica
    • Wide range of tune-ability for Copper and low-K/ULK removal rates
    • Ultra low defectivity
    • Excellent performance on soft pads
    • Concentrated formulation for low cost of ownership
  • BSL8176C
    • A concentrated version of BSL8072
    • Extremely wide range of tune-ability of Copper and low-k/ULK removal rates
    • High purity colloidal silica
    • Ultra-low defectivity
    • Excellent performance on soft pads
    • Concentrated formulation for low cost of ownership
  • BSL8072
    • Alkaline barrier slurry designed for a wide variety of integration schemes that utilize low-K dielectrics
    • High purity colloidal silica
    • Designed for 90nm and below technology nodes
    • Extremely wide range of tune-ability for Copper and low-K removal rates
    • Very low defectivity
    • Excellent performance on soft pads
  • Cu18K and Cu20K
    • Concentrated versions of Cu10K for reduced cost of ownership
    • Improved defectivity over Cu10K
  • Cu10K
    • Ready-to-use alkaline barrier slurry designed for 65nm and above technology nodes
    • High purity fumed silica
    • Excellent topography correction

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FUJIFILM Planar Solutions barrier CMP slurries are designed to remove the barrier metals that are exposed following the copper clearing step as well as a portion of the inter-metal dielectric.