Cleaners

Highly effective aqueous post ash residue cleaners for both Al/SiO2 and Cu/low-k BEOL processes.

Applications include removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics or etch residue removal in damascene processes with Cu, low-k and ultra-low-k compatibility.

  • Wide process latitude
  • Compatible with spray and batch tool applications
  • Compelling cost of ownership advantage over hydroxylamine (HA) solvent-based cleaners - Direct DI water rinse
    • Eliminates IPA rinsing chemical cost
    • Increased throughput by eliminating IPA-rinse steps
  • Safe and easy to use
  • Excellent process equipment materials compatibility
  • Superior metals and ILD compatibility
  • Packaging options :
    • 4 L HDPE bottle
    • 20L jerrican
    • 200 L drum

Contact Us for more information on the most suitable Fujifilm cleaner for your process needs

  • Removing etch residues at via, metal line, and bond pad levels on Al alloys, anti-reflective layers, and SiO2 dielectrics
  • Etch residue removal in damascene processes with Cu, low-k and ultra low-k compatibility.